Blar i SINTEF Open på forfatter "Sordo, Guido"

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    • Through Silicon Vias in MEMS packaging, a review 

      Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian (Lecture, 2019)
      Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) ...

    • Wafer bonding process for zero level vacuum packaging of MEMS 

      Sordo, Guido; Collini, Cristian; Moe, Sigurd T.; Poppe, Erik Utne; Wright, Daniel Nilsen (Chapter; Peer reviewed, 2020)
      It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees ...